In a recent published report, Kenneth Research has updated the Power Module Packaging Market report for for 2021 till 2030. Report further now discusses; the various strategies to be adopted or being adopted by the business players across the globe at various levels in the value chain. In the view of the global economic slowdown, we further estimated that China, India, Japan and South Korea to recover fastest amongst all the countries in the Asian market. Germany, France, Italy, Spain to take the worst hit and this hit is expected to be regain 25% by the end of 2021- Positive Growth in the economic demand and supply.
U.S. Market recovers fast; In a release on May 4th 2021, the U.S. Bureau and Economic Analsysis and U.S. Census Bureau mentions the recovery in the U.S. International trade in March 2021. Exports in the country reached $200 billion, up by $12.4 billion in Feb 2021. Following the continuous incremental trend, imports tallied at $274.5 billion, picked up by $16.4 billion in Feb 2021. However, as COVID19 still haunts the economies across the globe, year-over-year (y-o-y) avergae exports in the U.S. declined by $7.0 billion from March 2020 till March 2021 whilest imports increased by $20.7 billion during the same time. This definitely shows how the market is trying to recover back and this will have a direct impact on the Healthcare/ICT/Chemical industries, creating a huge demand for Power Module Packaging Market products.
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According to the statistics by the World Bank, the exports of ICT goods globally increased from 11.164% of total goods exports in 2017 to 11.53% of total goods exports in 2019. Additionally, exports of ICT services increased from 5.61% of service exports (BoP) in 2001 to 10.37% of service exports (BoP) in 2017.
The report offers detailed coverage of Power Module Packaging industry and main market trends with impact of coronavirus. The market research includes historical and forecast market data, demand, application details, price trends, and company shares of the leading Power Module Packaging by geography. The report splits the market size, by volume and value, on the basis of application type and geography.
First, this report covers the present status and the future prospects of the global Power Module Packaging market for 2015-2024.
And in this report, we analyze global market from 5 geographies: Asia-Pacific[China, Southeast Asia, India, Japan, Korea, Western Asia], Europe[Germany, UK, France, Italy, Russia, Spain, Netherlands, Turkey, Switzerland], North America[United States, Canada, Mexico], Middle East & Africa[GCC, North Africa, South Africa], South America[Brazil, Argentina, Columbia, Chile, Peru].
At the same time, we classify Power Module Packaging according to the type, application by geography. More importantly, the report includes major countries market based on the type and application.
Market Segment as follows:
*Asia-Pacific[China, Southeast Asia, India, Japan, Korea, Western Asia]
*Europe[Germany, UK, France, Italy, Russia, Spain, Netherlands, Turkey, Switzerland]
*North America[United States, Canada, Mexico]
*Middle East & Africa[GCC, North Africa, South Africa]
*South America[Brazil, Argentina, Columbia, Chile, Peru]
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*Mitsubishi Electric Corporation
*Texas Instruments Incorporated
*Sanken Electric Co., Ltd.
*Fuji Electric Co. Ltd.
*Infineon Technologies AG
Market by Type
Market by Application
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